Mangaluru, June 16, 2020: The invention ‘Scalable Modular Interconnect for Three-dimensional High-Performance Application- A new 3D topology for noc based systems’ of Dr.Niranjan N Chiplunkar has been granted a patent by Indian Patent Office recently.
‘SMITHA’ is a new three-dimensional architecture that helps in designing applications that would run faster than the existing system in a multicore system. This also enables more logic to be implanted on silicon.
The invention is conceived and developed by Dr. Niranjan N Chiplunkar, Principal, NMAMIT, Nitte & Dr. Sanju V, Associate Prof in the Dept of CSE, Nitte Meenakshi Institute of Technology, Yelahanka, Bangalore and P.Venkata Krishna, Professor, VIT University, Vellore.